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3U CompactPCI Plus IO

PC1-GROOVE: CompactPCI® PlusIO Core™ i7 Processor High Performance CPU Board

  • Intel® Core™ i7-600 Mobile Processor, Two Cores, 4 Threads, 3 Level Cache Hierarchy, Multi-Core CPU
  • CompactPCI® System Slot Controller, CompactPCI® PlusIO Rear I/O According to PICMG® 2.30
  • DDR3 Memory (Dual Channel Mode Capable, up to 1066MHz PC3-8500)
  • Intel® Mobile Series QM57 Express Chipset Platform Controller Hub (IbexPeak-M)
  • Three Port Graphics Controller (Front Panel: DisplayPort or VGA Connector)
  • Quad Gigabit Ethernet Controllers
  • Six Native SATA Channels 3Gbps
  • Two Additional SATA Channels 3Gbps, RAID capable with JMicron Drivers
  • Twelve USB 2.0 Channels
  • On-Board PCI Express® Packet Switch (4 Lanes available for Rear I/O and CPCI Serial Backplane Respectively, additional 4 Lanes for Mezzanine Side Card)
  • Variety of Mezzanine Expansion Boards (Side Cards) Available with and w/o PCIe
  • Most Mezzanines Optionally Equipped with 2.5-Inch Single- or Dual-Drive
Rugged Interconnect Technologies TM - PC1-GROOVE

PC2-LIMBO: Intel® Atom™ E6xx Series, 3U CompactPCI® Single Board Computer

  • Ultra Low Power Intel® Atom Processor up to 1.6 GHz
  • CompactPCI® System Slot Controller
  • CompactPCI® PlusIO Rear I/O According to PICMG® 2.30
  • DDR2 Soldered Memory up to 2GB
  • Dual Port Graphics Controller (Front Panel: DVI or VGA Connector Option)
  • Intel® EG20T (Topcliff) Platform Controller Hub (PCH)
  • SATA Channels with 3Gbps support
  • Twelve USB 2.0 Channels
  • Support CFast™, microSD and SATA 1.8-Inch Solid State Drive (SSD)
Rugged Interconnect Technologies TM - PC2-LIMBO

02F075P00: 3U CompactPCI® PlusIO Safe Railway Computer

  • 2x Intel Atom E6xx, 512 MB DDR2 RAM (each) for onboard dual redundancy
  • 1x Intel Atom E6xx, 1 GB DDR2 for I/O
  • Independent supervisors for each block
  • Fail-safe board architecture
  • Clustering of two F75P to raise availability
  • Event logging
  • Certifiable up to SIL 4 (with report from TÜV SÜD)
  • SIL 4 certification packages available for hardware and software (QNX)
  • Developed according to EN 50129, EN 50128 and IEC 61508
  • Full EN 50155 compliance
  • -40°C to +85°C qualified
  • Conformal coating
Rugged Interconnect Technologies TM - 02F075P00